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3CBAY

Product engineering · Shenzhen

The engineering behind your next device.

A Shenzhen hardware team. We design across four silicon tiers — MCU, WiFi/Bluetooth SoC, NPU-equipped Linux SoC and display driver — with FAE support direct from the chip makers, and the apps, mini programs and server come attached rather than subcontracted.

Hardware first
Schematic, PCB layout, structure and tooling are ours. A software house cannot do this part.
Four silicon tiers
MCU through NPU-class Linux SoC, domestic and overseas parts.
Direct vendor FAE
Escalation reaches the people who wrote the SDK.
Software attached
App, mini program and server built by the same team, so no one gets to point at the other side.
Designed toward
CEFCCRoHSREACHBQBEN 71

Silicon coverage

Four compute tiers, no vendor lock-in

From NPU-equipped Linux application processors down to motor-control MCUs, we design across every tier these products need — on both domestic and overseas silicon. Chip selection follows your cost, supply and certification constraints, not the one part we happen to know.

Linux SoC with NPU

0.5 – 16 TOPS

On-device AI, vision and video

Application processors with an integrated NPU, 0.5 to 16 TOPS depending on what has to stay local. At the 0.5–1 TOPS end: pet and object detection, human presence and behaviour analysis, wake word and speech recognition, alongside the ISP, H.264/H.265 encode and multi-camera MIPI input. From roughly 6 TOPS a quantised small language model runs on the device, which is what an offline fallback is actually made of, and at 16 TOPS multi-stream vision and a local model can share the part. Picking the tier is a cost decision as much as a technical one — more NPU than the product uses is money spent on the datasheet.

  • Rockchip
  • Anyka
  • SigmaStar
  • Amlogic
  • Allwinner
  • Ingenic
  • Unisoc

Pet Tech · AI Devices · Education

WiFi / Bluetooth SoC

Connectivity and audio

Connectivity and audio

WiFi SoCs for provisioning, streaming and cloud links; Bluetooth SoCs for BLE sensors, dual-mode and audio. These run an RTOS in a few hundred KB of RAM, so pairing reliability, OTA, power budget and the audio front-end are firmware problems rather than OS problems — and firmware is where most connected products actually fail.

  • Espressif
  • JieLi
  • Realtek
  • Bestechnic
  • Beken
  • Nordic
  • Telink

Wearables · AI Speakers · Pet Tech

MCU

Control, motors and power

Control, motors and power

Motor control, sensor sampling, charging and power sequencing. The unglamorous tier that decides whether a feeder jams, a dryer overheats, or a device wakes reliably at 2% battery.

  • STMicroelectronics
  • NXP
  • TI
  • GigaDevice
  • Nations
  • Sinowealth

Pet Tech · Wearables · All lines

Display driver

Panels, touch and AMOLED

Panels, touch and AMOLED

Panel selection, driver IC bring-up, touch integration and colour calibration. Screen quality is what a retail buyer judges in three seconds, so we treat the display chain as its own discipline.

  • Sitronix
  • Novatek
  • Ilitek
  • Solomon Systech
  • Focaltech

Wearables · Education · AI Devices

Rockchip Anyka SigmaStar Amlogic Allwinner Ingenic Unisoc Espressif JieLi Realtek Bestechnic Beken Nordic Telink STMicroelectronics NXP TI GigaDevice Nations Sinowealth Sitronix Novatek Ilitek Solomon Systech Focaltech Rockchip Anyka SigmaStar Amlogic Allwinner Ingenic Unisoc Espressif JieLi Realtek Bestechnic Beken Nordic Telink STMicroelectronics NXP TI GigaDevice Nations Sinowealth Sitronix Novatek Ilitek Solomon Systech Focaltech

Direct vendor FAE support

We work with silicon vendors directly, not through a design house or a distributor. A stubborn bug gets escalated to the people who wrote the SDK, new parts reach us at sampling stage, and pricing has one less layer in it.

Capabilities

A hardware team that also writes the software

Most teams sit on one side of this line. A software house cannot lay out a board or cut a mould; a factory that can usually subcontracts the firmware and the app. When a device will not pair, that split is where a project stalls — each side reports their part works. Here it is one team, so the question is just what to fix.

Hardware & structure

Schematic, PCB layout, ID/MD and tooling design. DFM review before a mould is cut.

Firmware & algorithms

Low-power firmware, PPG and motion algorithms, far-field audio, on-device vision models.

App, mini program & server

iOS, Android, WeChat and Alipay mini programs, plus the cloud platform behind them — device provisioning, OTA and the admin console.

Compliance planning

We map the certification path for your market at the brief stage, so it runs alongside tooling.

How we work

From brief to production

  1. 01

    Brief & feasibility

    Target market, price band, certifications. We return a platform recommendation and a cost envelope.

  2. 02

    Design & prototype

    Schematic, layout, structure and a working prototype to prove the concept.

  3. 03

    Tooling & validation

    Tooling alongside certification. EVT and DVT gates with reports at each.

  4. 04

    Production

    Built at a vetted partner line under our engineering supervision and test plan.

Tell us what you need to build.

Send the target market, quantity and certifications. You will hear back from an engineer, not a form letter, within one business day.

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